Solution

Card Qualification

Two cards with the same part number are not the same card. Fluid Silicon characterizes every LUT and carry block at speed before a card enters service: how much margin it has and where it is weak.

An FPGA accelerator card, drawn in isometric view

Measured impact

On production shells, at realistic utilization.

1 s
to characterize every logic element of a card
> 20%
random variation at 16, 14 and 7 nm, on top of systematic variation across the die
< 20 ps
per-link measurement precision

*Fluid Silicon measurements. Varies with variation pattern, workload, vendor and device age.

Incoming Characterization

Measure it before you trust it.

  • Every LUT and carry block measured at speed, about a second per card.
  • A per-card timing and variation report.
  • Tail cards identified on day one.
  • The same report on AMD and Altera parts.

Where evaluations start

A sample of your cards in staging, a report per card, no change to any operating point.

An FPGA accelerator card, drawn in isometric view

Weak-Resource Maps

Know where each chip is weak.

  • Measured slack mapped across the chip's logic elements.
  • Random, systematic and spatial variation shown separately.
  • Guidance for your next place-and-route, so critical paths avoid weak regions. Your current build is not touched.
  • Re-measured for the life of the card.

Spatial variation

Neighbouring resources drift together, so one weak region can hold several critical paths.

Slack across every element of one card, with its weakest element. Illustrative screen.

Margin-Based Binning

Sort cards by what they measured.

  • Cards binned by measured margin at their operating point.
  • The fastest cards matched to the workloads that need them.
  • Cards near the threshold kept out of critical roles.
  • One binning rule across vendors and nodes.

Beyond the datasheet

A speed grade covers the worst chip in the bin. Measured margin places each of your chips.

A margin per chip instead of one for the fleetThree chips measured separately, each with narrow distributions of LUT and carry link delays, and each signed off at its own measured delay plus under 20 picoseconds of error and drift. The fleet-wide worst-case corner is shown faintly on the right, no longer needed.Measured: a margin per chipFleet corner, no longer neededChip AChip BChip CPer-chip margin: error + drift, under 20 psPath delay →
LUT linksCarry linksPer-chip sign-off
Illustrative, not to scale.

Acceptance Evidence

A record from the first day to the last.

  • A signed-off timing report per card at acceptance.
  • The same measurement repeated in production and at exit.
  • Evidence for warranty claims and vendor feedback.
  • A history that supports resale, reuse or retirement.

Characterization brackets service

Once on the way in, continuously in production, once on the way out.

Illustrative aging model for one card at three temperaturesPath delay increase over years in service. Measured points for the first three years lie on a fitted aging curve, projected forward. At 70 degrees Celsius the projection crosses the 6 percent alert threshold at about 3.8 years, at 55 degrees at about 7.6 years, and at 45 degrees beyond 10 years.0%2%4%6%8%0246810Years in servicePath delay increaseAlert thresholdToday45 °C: > 10 yrs55 °C: 7.6 yrs70 °C: 3.8 yrs
45 °C55 °C70 °C
Illustrative model for one card.

FAQ

Common questions.

Sensor architecture, deployment mechanics and calibration methods are shared with evaluation partners under NDA.

Is characterization destructive or slow?

Neither. A full sweep takes about a second at operating speed. Nothing is written to your design and no operating point changes.

Do we need a special test rig?

No. Characterization runs on the card in staging, with the same health layer used in production.

What does the report contain?

Measured slack per logic element, the weakest elements, the variation pattern across the chip, and a margin figure for the card at its operating point.

Can we characterize cards already in service?

Yes. The same measurement runs in production with no downtime, so deployed cards get a baseline on their first sweep.

Which devices are supported?

AMD 7-series, UltraScale and UltraScale+ today, with select Altera Agilex 7 devices; more families in development. See device support.

How does this connect to tuning?

The report is the starting point for per-chip sign-off. Voltage and frequency scaling are separate, opt-in steps that use the same measurements.

Measure a device at speed, live.

A 30-minute session: in-system slack measurements on a supported AMD or Altera device, and what an evaluation on your boards involves.